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INTERNATIONAL PATENT: KYOCERA CORPORATION, 京セラ株式会社 FILES APPLICATION FOR "HEAT DISSIPATION STRUCTURE AND SUBSTRATE UNIT"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- KYOCERA CORPORATION (6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto6128501), 京セラ株式会社 (京都府京都&... Read More

INTERNATIONAL PATENT: DAIKIN INDUSTRIES, LTD., ダイキン工業株式会社 FILES APPLICATION FOR "THERMOPLASTIC POLYMER COMPOSITION AND METHOD FOR PRODUCING SAME"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- DAIKIN INDUSTRIES, LTD. (Osaka Umeda Twin Towers South, 1-13-1, Umeda, Kita-ku, Osaka-Shi, Osaka5300001), ダイキン工業株式会&#31... Read More

INTERNATIONAL PATENT: TOMOIKE BIO LTD., トモイケ　バイオ　リミテッド FILES APPLICATION FOR "BRANCHED MULTI-HYDROXYL-PROTECTING OLIGOMER, LINKED BODY BONDED THEREWITH AND BRANCHED MULTI-HYDROXYL OLIGOMER OBTAINED BY DEPROTECTING SAID LINKED BODY"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- TOMOIKE BIO LTD. (Room 1-10, 11F., CCT Telecom bldg., 11 Wo Shing St., Fo Tan, Shatin, N.T., The Hong Kong Special Administrative Region of the People's Republic of China999077), &#1... Read More

INTERNATIONAL PATENT: QUALICAPS CO., LTD., クオリカプス株式会社 FILES APPLICATION FOR "BAND SEAL, BAND SEALING SOLUTION, METHOD FOR SEALING HARD CAPSULE AND HARD CAPSULE PRODUCT"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- QUALICAPS CO., LTD. (321-5, Ikezawa-cho, Yamatokoriyama-shi, Nara6391032), クオリカプス株式会社 (奈良県&... Read More

INTERNATIONAL PATENT: C4U CORPORATION, Ｃ４Ｕ株式会社, THE UNIVERSITY OF TOKYO, 国立大学法人東京大学, RIKEN, 国立研究開発法人理化学研究所 FILES APPLICATION FOR "GUIDE RNA AND USE THEREOF"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- C4U CORPORATION (Techno-Alliance Building C 7th floor, Osaka Univ., 2-8, Yamadaoka, Suita-shi, Osaka5650871), Ｃ４Ｕ株式会社 (大&#3844... Read More

INTERNATIONAL PATENT: U-MAP CO., LTD., 株式会社Ｕ－ＭＡＰ FILES APPLICATION FOR "HEAT DISSIPATION FILLER, RESIN COMPOSITION AND RESIN MOLDED BODY"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- U-MAP CO., LTD. (1003, Cresto Motoyama, 1-29, Honami-cho, Chikusa-ku, Nagoya-shi, Aichi4640822), 株式会社Ｕ－ＭＡＰ (愛&#3... Read More

INTERNATIONAL PATENT: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., パナソニックＩＰマネジメント株式会社 FILES APPLICATION FOR "RESIN COMPOSITION FOR OPTICAL WAVEGUIDE AND DRY FILM AND OPTICAL WAVEGUIDE USING SAID RESIN COMPOSITION"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (22-6, Moto-machi, Kadoma-shi, Osaka5710057), パナソニックＩＰマネ&#1... Read More

INTERNATIONAL PATENT: TOSOH CORPORATION, 東ソー株式会社 FILES APPLICATION FOR "ETCHING COMPOSITION"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- TOSOH CORPORATION (4560, Kaisei-cho, Shunan-shi, Yamaguchi7468501), 東ソー株式会社 (山口県周南市開... Read More

INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "METHOD FOR PRODUCING BIOCOMPATIBLE MATERIAL AND BIOCOMPATIBLE MATERIAL"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央&#... Read More

INTERNATIONAL PATENT: MITSUBISHI GAS CHEMICAL COMPANY, INC., 三菱瓦斯化学株式会社 FILES APPLICATION FOR "ETCHING LIQUID AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE USING SAME"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- MITSUBISHI GAS CHEMICAL COMPANY, INC. (5-2, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008324), 三菱瓦斯化学株式会社 (東&... Read More